{"product_id":"fea-206-ansys-mechanical-electronics-simulation-applications-training","title":"FEA 206 - Ansys Mechanical Electronics Simulation Applications Training","description":"\u003ch6\u003eAdvanced Level Training - 2 days (16 hours)\u003cbr\u003e\n\u003c\/h6\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003ch4\u003eAbout Ansys Mechanical Electronics Simulation Applications Training by CADIT\u003cbr\u003e\n\u003c\/h4\u003e\n\u003cp\u003eUse Ansys Mechanical for semiconductor and electronics simulation — stress, thermal, vibration and packaging challenges such as warpage, wafer handling and solder joint fatigue — with trace mapping, submodelling and element birth\/death techniques.\u003c\/p\u003e\n\u003cp\u003ePerfect for Engineers in the semiconductor and electronics packaging industry.\u003c\/p\u003e\n\u003ch4\u003e\n\u003cbr\u003eLearning Outcomes\u003c\/h4\u003e\n\u003cp\u003e\u003cbr\u003eBy the end of this training, you will be able to:\u003cbr\u003e1. Apply Ansys Mechanical to solve common semiconductor industry analysis challenges.\u003cbr\u003e2. Execute simulations using Element Birth and Death to model manufacturing processes.\u003cbr\u003e3. Use submodeling techniques in warpage analysis to improve efficiency and accuracy.\u003cbr\u003e4. Generate mapped and structural hexahedral meshes for models.\u003cbr\u003e5. Model circuits efficiently and accurately.\u003cbr\u003e6. Parameterize simulations to perform DOE and optimize designs.\u003cbr\u003e7. Apply Trace Mapping and Trace Reinforcement techniques for IC\/PCB modeling.\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003ch4\u003eCourse Content\u003c\/h4\u003e\n\u003col\u003e\n\u003cli\u003eCircuit Modelling — Trace Mapping and Trace Reinforcement Process\u003cbr\u003e   - Workshop: ECAD data mapping\u003cbr\u003e   - Workshop: Trace Reinforcement Process\u003cbr\u003e2. Stacker Mesh: Advanced Meshing Process\u003cbr\u003e   - Workshop: PCB assembly part\u003cbr\u003e3. Parametric Solutions: Design Point Tables, Input vs Output Parameters\u003cbr\u003e   - Workshop: Globe valve associativity and parameter setup\u003cbr\u003e4. Submodelling with Element Birth and Death, Preventing Singular Matrix\u003cbr\u003e   - Workshop: Multi-level dielectric modelling, submodelling techniques and solder ball stress-strain analysis\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003ch4\u003eHRDCorp Claimable Ansys Mechanical course\u003cbr\u003e\n\u003c\/h4\u003e\n\u003cp\u003eCertificate of completion provided. If based in Malaysia, this course can be reimbursed with the HRDCorp Program through our certified trainers.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e","brand":"Cadit Training","offers":[{"title":"Default Title","offer_id":53458290311468,"sku":null,"price":0.0,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0918\/7894\/9164\/files\/fea-206-ansys-mechanical-electronics-simulation-applications-training-cadit.png?v=1784656616","url":"https:\/\/caditglobal.myshopify.com\/products\/fea-206-ansys-mechanical-electronics-simulation-applications-training","provider":"cadit.com","version":"1.0","type":"link"}